Thermotron’s Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test.
Thermotron’s ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods.
ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design.
With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput.
The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine